[China]Direct Bond Copper / DBC ceramic Substrate
DBC Ceramic Substrate
DBC(Direct Bond Copper) Substrate are used a special process in which the copper foil and the Al2O3 are directly bonded under appropriate high temperature, which applications are power semiconductor modules, thermoelectric cooling modules, electronic heating devices, power control circuits, power hybrid circuit.
Benefits
High mechanical strength,mechanicallly stable shape
Better thermal cycling capabilities, high reliability.
Environmentally friendly
Additional information:
Place of origin: | China |
Brand: | ELECERAMIC |
Price: | 1 USD |
Price Terms: | FOB |
Packing: | VACUUM |
Delivery time: | 30 days |
Minimum order: | 500 |
Quality/Certifications: | ISO9001:2000 |
Category: Electronics, electrical engineering -> Electronics -> Components
ELE Advanced Ceramics
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Street: | R/2302 Dihao Building, #820 Xiahe Road |
City: | Xiamen |
Postal code: | 361004 |
Country: | China |
Phone: | +86 592 2960185 |
Fax: | +86 592 2960178 |
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Contact person |
Name and Surname: | James Qiu |
Phone: | +86 592 2960185 |
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